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SEMICON Taiwan 2025 Opens with Record Participation, Showcasing AI-Driven Innovation and Global Collaboration
SEMICON Taiwan 2025 officially kicked off today, September 10, at the Taipei Nangang Exhibition Center, marking a significant moment for the global semiconductor industry. Celebrating its 30th anniversary, this year’s event is the largest yet, with over 1,200 companies, 4,100 booths, and representatives from 56 countries participating.
Under the theme "Leading with Collaboration. Innovating with the World," the event is a platform for industry transformation driven by AI, high-performance computing (HPC), and advanced manufacturing. With forums beginning on September 8 and exhibitions running through September 12, SEMICON Taiwan 2025 has positioned itself as a key global hub for innovation and strategic partnership.
AI Boom and Advanced Packaging Reshape Global Market
One of the main drivers of this year’s event is the global boom in AI. According to SEMI’s market intelligence, AI demand is rapidly expanding from cloud computing to edge devices. This surge is pushing capital expenditures by the top four cloud service providers from US$210 billion in 2024 to a projected US$310 billion in 2025. It’s no surprise that AI and HPC-related equipment investments are set to account for 40% of global semiconductor equipment spending this year, expected to exceed 55% by 2030.
Taiwan is responding with strong investment. In 2025, Taiwan’s semiconductor equipment spending is projected to hit US$28 billion, a year-on-year increase of more than 70%. Technologies like 3D stacking, HBM (high-bandwidth memory), chiplet packaging, and gate-all-around (GAA) are becoming key focuses.
A major highlight of SEMICON Taiwan 2025 is the launch of the 3DIC Advanced Manufacturing Alliance (3DICAMA). This alliance brings together 37 major companies, including Unimicron, Delta Electronics, and Topco Scientific. The alliance aims to enhance cross-domain collaboration, establish technical standards, and strengthen Taiwan’s global position in 3DIC and advanced packaging.
Global Stage for Collaboration, Talent, and Cybersecurity
SEMICON Taiwan 2025 also emphasizes the growing importance of cross-border collaboration. The event features a record 17 national pavilions, including newcomers from Canada, Costa Rica, Lithuania, Sweden, and Vietnam, as well as independent delegations from countries like the U.S., Spain, and Italy.
High-profile forums throughout the week reflect Taiwan's leadership. On September 9, TSMC, ASML, and Applied Materials spoke at the IC Forum on Advanced Chip Technology and Manufacturing. The week concludes with the launch of the SEMI E187 Certification, the world’s first semiconductor equipment cybersecurity standard, at the Semiconductor Cybersecurity Global Summit. This initiative, led by Taiwan, is designed to secure global supply chains and reduce cyber risks across fabs and suppliers.
Taiwan cybersecurity startup JMEM TEK (振生半導體) also presented at SEMICON Taiwan 2025 in the “Silicon Startups Zone,” showcasing its PUF-based post-quantum cryptography chip recently certified by NIST CAVP. By integrating the latest ASCON algorithm, JMEM TEK highlighted Taiwan’s rising leadership in next-generation hardware security solutions.
The event also nurtures the future of the industry. The SEMI Taiwan 20 Under 40 Award recognized 24 rising stars, signaling efforts to address the growing talent gap.
The debut of the Silicon Startups Zone, co-organized with the IC Taiwan Grand Challenge (ICTGC), brings a spotlight to next-gen tech such as AI silicon photonics, Wi-Fi 7 RF, post-quantum cryptography, and SiC power devices. With over 200 global speakers and 25 forums, the event is bridging academia, startups, and tech giants alike.
“Taiwan’s comprehensive ecosystem across design, manufacturing, and applications is a key reason the world turns to us,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “SEMICON Taiwan is not just a showcase, but a launchpad for global cooperation.”
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